Professor HILMAR RAESCHKE-KESSLER, LL.M., FCI Arb

Born 1943 in Mühlhausen/ Germany.
1961 high school student-exchange to Los Angeles/Calif., USA;
1965 Abitur.

Study of law at Bonn and Göttingen Universities and at the University of Chicago Law School (LL.M. 1975).

Bar admission 1975;
since 1986 member of the bar of the German Federal Supreme Court (Rechtsanwalt beim Bundesgerichtshof, 43 members only);
numerous publications on issues of international arbitration and substantive law;
honorary professor at the Law School of the University of Cologne.

Areas of Practise:

(1) International and domestic Arbitration:

Since 1985 numerous international and domestic arbitrations as chairman, sole arbitrator or party appointed arbitrator under ICC, DIS, ad hoc and other arbitration regimes. Subject matters were maily related to post-M&A, corporate and commercial law, telecommunications, public procurement, foreign investment, privatization and construction.

(2) Appeals to the Bundesgerichtshof (German Federal Supreme Court), i.a. in corporate and commercial matters or related to the enforcement or annulment of international or domestic arbitral awards.

(3) Activities:

	Board Member German Arbitration Institution - DIS -,
	Vice President German branch of the International Law Association - ILA -,
	Board Member Heidelberg Center for International Dispute Resolution at the University Heidelberg,
	Past Member working group IBA - Rules on the Taking of Evidence in International Commercial Arbitration (1999) and their 2010 revision;
	Past Member IBA - Guidelines on Conflicts in International Arbitration (2004),
	Member ICC - Commission on International Arbitration,
	Past Co-Chair ICC Task Force on Guidelines for ICC Expertise Proceedings,
	Past Vice Chair, IBA - Committee on Arbitration (Committee D),
	Past Vice President London Court of International Arbitration - European Users' Council - LCIA -,
	selected by the PCA as Presiding Arbitrator:
	Member Swiss Arbitration Association - ASA -,
	Panel of Arbitrators: ICDR, Kuala Lumpur, SIAC, Vienna.